SEMI108 FHE for Medical & Industrial Applications

This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.

This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  

Course Outline

• Flexible hybrid electronics:  definition, design, and fabrication
• Challenges to interface hard and soft electronic components
• Introduction to the IEEE Heterogeneous Integration Roadmap (HIR)
• Overview of inks and encapsulants
• Printing methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing
• Electromechanical evaluation of printed interconnects
• Additive manufacturing of resistors and capacitors
• Highly stretchable conductors
• Interconnecting in the z direction - printed vias
• Printed RF devices and antennas
• Device and component placement and assembly
• Thinned semiconductor devices
• Approaches to bond devices and components to flexible substrates
• Concepts of operation and evaluation of performance and reliability
• Applications to medical and industrial sensors will be incorporated throughout

Instructor:  Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 

His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.